Amkor Technology (AMKR) closed at $41.82 on Oct 16, 2026, down 5.1% on the day. The stock is down 12.8% over the past month, down 33.2% over three months, up 5.9% year to date and up 34.0% over the past year. It trades 56.7% below its 52-week high of $96.68 and 42.1% above its 52-week low of $29.44. The close sits below its 50-day moving average ($50.91) and below its 200-day moving average ($57.69).
NextPick tracks AMKR in its Foundry/OSAT basket alongside TSM, INTC, ASX, UMC and GFS. As of Oct 16, 2026, the basket's money-flow score is -32 (outflow), and the basket is down 11.6% over five sessions. Over the past month AMKR ranks 4th of 6 basket members by price change.
AMKR is scheduled to report earnings on Oct 26, 2026. Over its last 8 reports the stock moved an average of 9.1% on the first trading day after earnings, beating the options-implied move in 3 of 8.
AMKR options were pricing 74% at-the-money implied volatility on Oct 12, 2026, an IV rank of 34 over the past year. Form 4 filings over the last 90 days show no open-market purchases and 9 open-market sales by insiders.
Single-day -24.74%, which sentence caused AMKR to crash?
Despite earnings reports exceeding expectations across the board, it dropped 20% in a single day. The real repricing is the AI capacity gamble supported by $2.5-3 billion in capital investment.
Jul 29, 2026
Amkor Technology is scheduled to report on Oct 26, 2026.
Over the last 8 reports, AMKR moved an average of 9.1% on the first trading day after earnings. The move beat the options-implied move in 3 of 8 reports.
No — the Oct 16, 2026 close of $41.82 is 27.5% below the 200-day average of $57.69.
AMKR closed 56.7% below its 52-week high of $96.68.
NextPick groups AMKR with TSM, INTC, ASX, UMC and GFS in its Foundry/OSAT basket.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
