KLIC

Kulicke and Soffa Industries, Inc. (KLIC)

Monday, October 19, 2026
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Kulicke and Soffa Industries (KLIC) at a glance

Close · Oct 19, 2026
$81.32
Day change
+3.42%
52-week range
$34.75 – $135.80
Market cap
$4.1B
Sector
Technology
Industry
Semiconductor Equipment & Materials
Exchange
NASDAQ

Kulicke and Soffa Industries stock: what the data says

Kulicke and Soffa Industries (KLIC) closed at $81.32 on Oct 19, 2026, up 3.4% on the day. The stock is down 2.2% over the past month, down 25.1% over three months, up 79.0% year to date and up 106.2% over the past year. It trades 40.1% below its 52-week high of $135.80 and 134.0% above its 52-week low of $34.75. The close sits below its 50-day moving average ($87.46) and below its 200-day moving average ($85.36).

NextPick tracks KLIC in its Deposition/Etch basket alongside LRCX, AMAT, ENTG, ACMR and UCTT. As of Oct 19, 2026, the basket's money-flow score is -46 (outflow), and the basket is down 13.5% over five sessions. Over the past month KLIC ranks 2nd of 6 basket members by price change.

KLIC stock: key questions

Is KLIC above its 200-day moving average?

No — the Oct 19, 2026 close of $81.32 is 4.7% below the 200-day average of $85.36.

How far is KLIC from its 52-week high?

KLIC closed 40.1% below its 52-week high of $135.80.

What stocks are similar to KLIC?

NextPick groups KLIC with LRCX, AMAT, ENTG, ACMR and UCTT in its Deposition/Etch basket.

About Kulicke and Soffa Industries, I

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced wedge and wedge semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.

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